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1. product profile 1.1 general description silicon monolithic microwave in tegrated circuit ( mmic) amplifier consisting of an npn double polysilicon transistor with integrated biasing for lo w voltage applications in a plastic, 4-pin dual-emitter sot343r package. 1.2 features and benefits ? low current, low voltage ? very high power gain ? low noise figure ? integrated temperature compensated biasing ? supply and rf output pin combined ? aec-q100 qualified, see section 8.1 1.3 applications ? lnb if amplifiers ? general purpose low noise wideband amplifier for frequencies between dc and 2.2 ghz ? high frequency oscillators ? high frequency oscillators ? satellite televisi ons tuners (satv) ? high frequency oscillators 1.4 quick reference data BGA2002 mmic amplifier rev. 4 ? 9 february 2011 product data sheet table 1. quick reference data symbol parameter conditions min typ max unit v cc supply voltage rf input ac coupled - - 4.5 v i cc supply current v bias = 2.5 v; rf input ac coupled 3 4.5 6 ma msg maximum stable gain v bias = 2.5 v; f = 1.8 ghz; t amb = 25 c -19.5- dbm nf noise figure v bias = 2.5 v; f = 1.8 ghz; s = opt -1.3- dbm
BGA2002 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 4 ? 9 february 2011 2 of 15 nxp semiconductors BGA2002 mmic amplifier 2. pinning information 3. ordering information 4. marking 5. limiting values table 2. pinning pin description simplified outline graphic symbol 1gnd 2, 5 rfin 3gnd 4v cc + rfout 21 4 3 001aam98 1 gnd rfin v cc + rfout bias circuit table 3. ordering information type number package name description version BGA2002 - plastic surface mounted package; reverse pinning; 4 leads sot343r table 4. marking type number marking code description BGA2002 a2* * = p: made in hong kong * = t: made in malaysia table 5. limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit v cc supply voltage rf input ac coupled - 4.5 v i cc supply current forced by dc voltage on rf input -30ma p tot total power dissipation t sp = 100 c-135mw t stg storage temperature ? 65 +150 c t j junction temperature - 150 c
BGA2002 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 4 ? 9 february 2011 3 of 15 nxp semiconductors BGA2002 mmic amplifier 6. thermal characteristics 7. characteristics table 6. thermal characteristics symbol parameter conditions typ unit r th(j-sp) thermal resistance from junction to solder point p tot = 135 mw; t sp = 100 c 350 k/w table 7. characteristics v bias = 2.5 v; i bias = 4 ma; t amb = 25 c; unless otherwise specified. symbol parameter conditions min typ max unit i cc supply current v bias =1v - 0.7 - ma v bias =2.5v 3 4.5 6 ma v bias =4.5v - 11 - ma msg maximum stable gain f = 900 mhz - 22 - db f = 1800 mhz - 19.5 - db | s21 | 2 insertion power gain f = 900 mhz - 18 - db f = 900 mhz - 14 - db p l(1db) output power at 1 db gain compression i bias = 4.4 ma; f = 900 mhz - ? 2- dbm nf noise figure s = opt ; f = 900 mhz - 1.3 - db s = opt ; f = 1800 mhz - 1.3 - db ip3 i input third-order intercept point i bias = 4.4 ma; f = 900 mhz - ? 7.4 - dbm i bias = 4.4 ma; f = 1800 mhz - ? 4.5 - dbm fig 1. typical application circuit fig 2. power derating curve 001aam9 19 100 pf r1 c c v bias v cc rf out rf in in gnd gnd l1 BGA2002 t sp ( c) 0 200 150 50 100 001aam920 100 50 150 200 p tot (mw) 0
BGA2002 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 4 ? 9 february 2011 4 of 15 nxp semiconductors BGA2002 mmic amplifier (1) v bias =1v (2) v bias =1.5v (3) v bias =2v (4) v bias =2.5v (5) v bias =3v (6) v bias =3.5v (7) v bias =4v (8) v bias =4.5v fig 3. bias current as a function of ambient temperature; typical values fig 4. bias current as a function of voltage at the output pin; typical values f = 900 mhz. f = 1800 mhz. fig 5. gain as a function of bias current; typical values fig 6. gain as a function of bias current; typical values t amb ( c) ? 40 120 80 040 001aam921 4 8 12 i bias (ma) 0 (8) (7) (6) (5) (4) (3) (2) (1) v bias (v) 05 4 23 1 001aam922 8 4 12 16 i bias (ma) 0 i bias (ma) 010 8 46 2 001aam923 10 20 30 gain (db) 0 g um msg i bias (ma) 010 8 46 2 001aam924 10 15 5 20 25 gain (db) 0 msg g um
BGA2002 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 4 ? 9 february 2011 5 of 15 nxp semiconductors BGA2002 mmic amplifier v bias =25v; i bias = 4 ma. (1) f = 2400 mhz (2) f = 1000 mhz (3) f = 900 mhz (4) f = 1800 mhz fig 7. gain as a function of frequency; typical values fig 8. minimum noise figure as a function of frequency; typical values f (mhz) 10 2 10 4 10 3 001aam925 20 10 30 40 gain (db) 0 g um g max msg 001aam926 1 2 3 nf min (db) 0 i bias (ma) 10 ? 1 10 1 (1) (2) (3) (4)
BGA2002 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 4 ? 9 february 2011 6 of 15 nxp semiconductors BGA2002 mmic amplifier f = 900 mhz; v bias = 2.5 v; i bias = 4 ma; z o =50 . (1) g = 22 db (2) g = 21 db (3) g = 20 db (4) nf = 1.3 db (5) nf = 1.5 db (6) nf = 1.7 db fig 9. noise, stability and ga in circles; typical values 001aam927 90 ? 90 5 0.2 + 0.2 0 + 5 ? 5 ? 2 ? 0.2 + 0.5 ? 0.5 + 1 ? 1 2 10 0 0.2 0.6 0.4 0.8 1.0 1.0 ? 45 ? 135 45 135 180 0 unstable region load unstable region source (4) (3) (5) (6) (2) (1) opt 0.5 1 + 2
BGA2002 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 4 ? 9 february 2011 7 of 15 nxp semiconductors BGA2002 mmic amplifier f = 1800 mhz; v bias = 2.5 v; i bias = 4 ma; z o =50 . (1) g = 19 db (2) g = 18 db (3) g = 17 db (4) nf = 1.3 db (5) nf = 1.5 db (6) nf = 1.7 db fig 10. noise, stability and gain circles; typical values 001aam928 90 ? 90 5 0.5 0.2 + 0.2 0 + 2 + 5 ? 5 ? 2 ? 0.2 ? 0.5 ? 1 1 10 0 0.2 0.6 0.4 0.8 1.0 1.0 ? 45 ? 135 45 135 180 0 unstable region load unstable region source opt (3) (2) (4) (5) (6) (1) 2 + 0.5 + 1
BGA2002 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 4 ? 9 february 2011 8 of 15 nxp semiconductors BGA2002 mmic amplifier v bias = 2.5 v; i bias = 4 ma; z o =50 . fig 11. common emitter input reflection coefficient (s 11 ); typical values v bias = 2.5 v; i bias = 4 ma; z o =50 . fig 12. common emitter forward transmission coefficient (s 21 ); typical values 001aam929 90 ? 90 5 0.5 0.2 + 0.2 0 + 2 + 5 ? 5 ? 2 ? 0.2 + 0.5 ? 0.5 + 1 ? 1 2 1 10 0 0.2 0.6 0.4 0.8 1.0 1.0 ? 45 ? 135 45 135 180 0 100 mhz 200 mhz 500 mhz 900 mhz 1 ghz 1.8 ghz 3 ghz 001aam930 90 ? 90 ? 45 ? 135 45 135 0 0 180 10 8 6 4 2 200 mhz 900 mhz 500 mhz 1 ghz 1.8 ghz 3 ghz 100 mhz
BGA2002 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 4 ? 9 february 2011 9 of 15 nxp semiconductors BGA2002 mmic amplifier v bias = 2.5 v; i bias = 4 ma; z o =50 . fig 13. common emitter reverse transmission coefficient (s 12 ); typical values v bias = 2.5 v; i bias = 4 ma; z o =50 . fig 14. common emitter output reflection coefficient (s 22 ); typical values 001aam931 90 ? 90 ? 45 ? 135 45 135 0 180 0.5 0.4 0.3 0.2 0.1 100 mhz 3 ghz 001aam932 90 ? 90 5 0.5 0.2 + 0.2 0 + 2 + 5 ? 5 ? 2 ? 0.2 + 0.5 ? 0.5 + 1 ? 1 2 1 10 0 0.2 0.6 0.4 0.8 1.0 1.0 ? 45 ? 135 45 135 180 0 100 mhz 200 mhz 500 mhz 900 mhz 1 ghz 1.8 ghz 3 ghz
BGA2002 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 4 ? 9 february 2011 10 of 15 nxp semiconductors BGA2002 mmic amplifier 8. test information 8.1 quality information all qualification tests are performed accord ing aec-q100 except for read point testing, this is done only at room temperature.
BGA2002 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 4 ? 9 february 2011 11 of 15 nxp semiconductors BGA2002 mmic amplifier 9. package outline fig 15. package outline sot343r references outline version european projection issue date iec jedec eiaj sot343r d a a 1 l p q detail x c h e e v m a a b 0 1 2 mm scale x 21 4 3 plastic surface-mounted package; reverse pinning; 4 leads sot343 r w m b 97-05-21 06-03-16 b p unit a 1 max b p cd e b 1 h e l p qw v mm 0.1 1.1 0.8 0.4 0.3 0.25 0.10 0.7 0.5 2.2 1.8 1.35 1.15 e 2.2 2.0 1.3 e 1 0.2 y 0.1 0.2 1.15 dimensions (mm are the original dimensions) 0.45 0.15 0.23 0.13 e 1 a e y b 1
BGA2002 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 4 ? 9 february 2011 12 of 15 nxp semiconductors BGA2002 mmic amplifier 10. abbreviations 11. revision history table 8. abbreviations acronym description if intermediate frequency lnb low-noise block converter npn negative posi tive negative rf radio frequency table 9. revision history document id release date data sheet status change notice supersedes BGA2002 v.4 20110209 product data sheet - BGA2002 v.3 modifications: ? section 8 on page 10 : has been added. BGA2002 v.3 20101102 product data sheet - BGA2002 v.2 modifications: ? status changed from objective to product. ? the format of this data sheet has been redesi gned to comply with the new identity guidelines of nxp semiconductors. ? legal texts have been adapted to the new company name where appropriate. BGA2002 v.2 19980901 objective data sheet - -
BGA2002 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 4 ? 9 february 2011 13 of 15 nxp semiconductors BGA2002 mmic amplifier 12. legal information 12.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 12.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 12.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interrupt ion, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. export control ? this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from national authorities. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this docu ment contains the product specification.
BGA2002 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 4 ? 9 february 2011 14 of 15 nxp semiconductors BGA2002 mmic amplifier non-automotive qualified products ? unless this data sheet expressly states that this specific nxp semicon ductors product is automotive qualified, the product is not suitable for automotive use. it is neither qualified nor tested in accordance with automotive testing or application requirements. nxp semiconductors accepts no liabili ty for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. in the event that customer uses t he product for design-in and use in automotive applications to automotive s pecifications and standards, customer (a) shall use the product without nxp semiconductors? warranty of the product for such automotive applicat ions, use and specifications, and (b) whenever customer uses the product for automotive applications beyond nxp semiconductors? specifications such use shall be solely at customer?s own risk, and (c) customer fully in demnifies nxp semi conductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive app lications beyond nxp semiconductors? standard warranty and nxp semiconduct ors? product specifications. quick reference data ? the quick reference data is an extract of the product data given in the limiting values and characteristics sections of this document, and as such is not comp lete, exhaustive or legally binding. 12.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. 13. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com
nxp semiconductors BGA2002 mmic amplifier ? nxp b.v. 2011. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 9 february 2011 document identifier: BGA2002 please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 14. contents 1 product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 general description . . . . . . . . . . . . . . . . . . . . . 1 1.2 features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 6 thermal characteristics . . . . . . . . . . . . . . . . . . 3 7 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 8 test information . . . . . . . . . . . . . . . . . . . . . . . . 10 8.1 quality information . . . . . . . . . . . . . . . . . . . . . 10 9 package outline . . . . . . . . . . . . . . . . . . . . . . . . 11 10 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 12 11 revision history . . . . . . . . . . . . . . . . . . . . . . . . 12 12 legal information. . . . . . . . . . . . . . . . . . . . . . . 13 12.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 13 12.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 12.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 12.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 14 13 contact information. . . . . . . . . . . . . . . . . . . . . 14 14 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

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